泰瑞達(dá)Teradyne J750 Test System 數(shù)字信號測試機(jī)


Test Solution for Low Cost, High Efficiency Parallel Test

Teradyne s J750 platform is the industry standard for cost-effective test of a broad set of diverse microcontroller, FPGA and digital audio/baseband devices. The system is widely available at more than 50 OSAT locations and is supported by a complete set of production interface solutions for wafer sort and final test.

Microcontroller

FPGA

Digital Audio / baseband Device

LCD Driver, Touchscreen Sensors and Touch Display Driver Integration (TDDI)

Teradyne packs power and performance into the compact, economical J750 family of semiconductor test systems.

Low capital cost

Easily upgradeable from current J750 systems to J750Ex-HD

Zero footprint design for minimum use of space on the manufacturing floor

IG-XL software for rapid program development that automatically scales to multisite, saving development time and cost

Configurations

All J750 family systems are DIB compatible and use IG-XL software. Test programs for all J750 systems can be quickly migrated to a new system, with translation taking less than an hour for most programs.

J750Ex

Up to 512 or 1024 multifunction pins

Data rate up to 200 MHz / 400 Mbps

Vector Memory depth up to 64M per pin with integrated SCAN

J750Ex-HD

Up to 2048 multifunction pins

Data rate up to 400 MHz / 800 Mbps

Vector Memory depth up to 128M per pin

J750-LitePoint

Available as an RF upgrade to all J750 models

Support for up to 32 ports

Scalable configurations for cellular and connectivity RF applications

Learn more about the J750-LitePoint

J750 - LCD Driver Instrument Solution??

Configurable to 2,416 channel LCD Meter

Support for high-speed, multilate LVDS interfaces (e.g., MIPI),

Learn more about the LCD Driver Instrument solution

System Options

J750 has a complete suite of digital, DC and analog instrumentation to cover a broad range of consumer semiconductor test requirements and offer densities to deliver high site count testing.

DPS (Device Power Supply) for precision controlled device power

HDVIS (High Density VI Source) for higher site count and pattern control

MSO (Mixed Signal Option) for embedded analog, audio and mixed signal test

CTO (Converter Test Option) for testing embedded converters

APMU (Analog Pin Measurement Unit) for mixed signal test

RFID for testing embedded ID interfaces

MTO (Memory test option) for embedded memory test

DSSC (Digital Signal Source Capture) behind each pin for memory, mixed signal and DFT

DSHRAM (Deep Scan History RAM)

HVD (High Voltage Digital)

RF

LitePoint IQxel-M (Wireless Connectivity test option)

LitePoint IQxstream (Wireless Cellular test option)

Teradyne s award-winning IG-XL Software transforms test program development. Its powerful, yet easy-to-use, graphical environment lets engineers rapidly develop fully functional test programs, cutting program development and debugging time. Designed to address multisite complexity, IG-XL can convert single site test programs to multisite automatically, speeding time to market and reducing cost of test. With IG-XL, test engineers focus on actual testing, not writing code for the tester.

Learn more about IG-XL Software

J750系列已經(jīng)成為圖像傳感器和微控制器等低成本消費SoC設(shè)備市場行業(yè)標(biāo)準(zhǔn)的測試系統(tǒng)。J750ExHD反應(yīng)了泰瑞達(dá)不斷進(jìn)行研發(fā)投資，以滿足該成本敏感型設(shè)備市場不斷變化的測試與測量需求。HD的高密度儀器支持同時測試更多芯片，從而進(jìn)一步拉低各芯片的測試成本。zui新添加的產(chǎn)品包括一個48通道的設(shè)備電源、一個128通道的800Mbps多功能數(shù)字儀器和一個72通道的轉(zhuǎn)換器測試選擇。

J750 Tester 

For Advanced Microcontrollers and Consumer SoC Package Test Wafer Sort

The J750Ex provides highly economical, parallel test solutions for high-performance microcontrollers, consumer SoC devices, and digital wafer sort applications.

All J750 systems are DIB compatible, and the tens of thousands of J750 test programs can be run on the J750Ex. The J750Ex gives you the test throughput, coverage, and performance to handle the next generation of high-volume, low cost devices.

System features includes:

200 MHz / 400 Mbps digital

Up to 1024 digital pins, 96 devices power supplies, and analog test capabilty

Deep Vector Memory up to 64 LVM

Enchanced DFT capability with 196 Gbit scan depth and deep diagnostic capture

Per-pin architecture, pattern-controlled instrumention, and flexible site mapping with no slot boundaries

IG-XL test software for rapid program development that automatically scales to multisite

Specifications

I/O Channels Up to 512 or 1024

Data Rate Up to 100 MHz

High Voltage Drivers 1 per 16 digital channels

Parallel Test Site Count (max) Greater than x256

Vector Memory Depth Up to 16M per pin with integrated SCAN

Device Power Supplies Up to 32 power supplies

Scan Depth Up to 49 Gbit

Software IG-XL Software

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